SJSemi (SMIC- JCET joint-venture Company) offer high-quality and advance bumping and testing service on various platforms to support customer to approach the market faster.

SMIC cooperates with world-class OSAT (Outsourced Semiconductor Assembly and Test) to offer more comprehensive services for customer requirements, including Wafer Bumping, Wafer Level Package, Chip Scale Package, Conventional Package,  Testing and On-chip Color Filter services.