Backend Turnkey Service
Backend Turnkey Service
SMIC offers comprehensive services from wafer manufacturing to finish goods IC to customers.
SMIC cooperates with world-class OSAT (Outsourced Semiconductor Assembly and Test) to offer more comprehensive services for customer requirements, including Wafer Bumping, Wafer Level Package, Chip Scale Package, Conventional Package, Testing and On-chip Color Filter services.
Backend Turnkey Service Partner
If you have backend requirement, please contact SMIC Sales Team.