Press Releases

Semiconductor Manufacturing International Corporation Announces Proposed Dual Listing on SEHK and NYSE

07 Mar 2004

shanghai  [2004-03-07]

(March 7, 2004 - Hong Kong) Semiconductor Manufacturing International Corporation ("SMIC" or "the Company"), one of the leading semiconductor foundries in the world, announced today the offering details of its shares on The Stock Exchange of Hong Kong ("SEHK") and American Depositary Shares ("ADSs") on the New York Stock Exchange ("NYSE").

SMIC's global offering is expected to consist of an offering of ADSs in a public offering in the United States and on a private placement basis in Canada, an international offering of ADSs outside the United States and Canada, including to institutional and corporate investors in Hong Kong and in a public offering without listing in Japan, and a Hong Kong public offering of ordinary shares. The ADSs are to be offered by SMIC and certain of its shareholders. SMIC will not receive any proceeds from the offering by the selling shareholders. This proposed offering would result in new financing for SMIC.

SMIC and certain of its existing shareholders intend to offer a total of 5,151,515,000 ordinary shares (including ordinary shares represented by ADSs but excluding 772,727,000 ordinary shares available to cover over-allotments). 4,893,939,000 ordinary shares, or 95%, will be allocated to the U.S. offering and the international offering, and 257,576,000 ordinary shares, or 5%, will be allocated to the Hong Kong public offering. The price range for the Hong Kong public offer is between HK$2.39 and HK$2.69 per ordinary share.

Copies of a preliminary prospectus can be obtained from the joint bookrunners at: Credit Suisse First Boston, Prospectus Department, 11 Madison Avenue, New York, New York, Telephone: 212-325-2580 or Prospectus Department, Deutsche Bank Securities, 60 Wall Street, 4th Floor, New York, New York 10005, Telephone: 212-250-2500.

Prospectuses and application forms for the Hong Kong public offer will be available to investors from 9:00 am on Monday, March 8, 2004 at locations as described in the formal notice to be published during the offer period, and will contain full details about the Hong Kong public offer and the Company. The Hong Kong public offer will close at 12:00 noon on Thursday, March 11, 2004 and the final offer price is expected to be published on or before Wednesday, March 17, 2004. Dealing in the ADSs on the NYSE is expected to commence on Wednesday, March 17, 2004. Dealing in the shares on the SEHK is expected to commence on Thursday, March 18, 2004.

Credit Suisse First Boston is the global coordinator of the share offer. Credit Suisse First Boston (Hong Kong) Limited and Deutsche Bank AG, Hong Kong Branch are the joint bookrunners.

About SMIC
SMIC is one of the leading semiconductor foundries in the world. As a foundry, SMIC fabricates semiconductors for customers based on their own or third parties’ integrated circuit designs. SMIC was founded in April 2000 and currently offers a wide range of leading edge integrated wafer manufacturing services, including copper interconnects capabilities, to its global customer base. SMIC operates 8-inch wafer fabrication facilities in the Zhangjiang High-Tech Park in Shanghai, China and, as a result of a recent acquisition, an 8-inch wafer fab in Tianjin, China. In addition, SMIC is currently constructing 12-inch wafer fabrication facilities in Beijing, China