Press Releases

SMIC's 0.35µm EEPROM enables smaller die size for higher performance contactless smart cards

08 Jun 2004

Shanghai, China  [2004-06-08]

(Shanghai, China, June 8th, 2004) - Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) today announced the successful development and immediate availability of 0.35um EEPROM-based Contactless Smart Card technology. The uniqueness of the technology is that it offers up to 50% die size shrinkage for contactless smart cards.

Core to this new contactless process technology is the recently developed high voltage P-channel transistors and Metal-Insulator-Metal (MIM) capacitors resulting in die shrinkage and improved performance. The applications of the contact and contactless smart card technology include transportation cards, identification cards and bankcards.

Using SMIC’s contactless smart card technology, several customers have already successfully incorporated this technology into their end products.

"This is a significant technology development due to the potential market size and the number of possible applications, particularly in China, “ said Mr. Roger Lee, vice president of SMIC's Memory Technology Development Center. “Enhancing our customers’ competitive edge remains our key focus and we are now developing 0.18µm EEPROM for their future needs," he added.

SMIC’s Memory Technology Development Center has also been actively developing and implementing DRAMs, Flash, embedded Flash, advanced EEPROM-based smart card technology, high-voltage LCD drivers, LCOS micro display and CMOS image sensors.

About SMIC

SMIC is one of the leading semiconductor foundries in the world. As a foundry, SMIC provides integrated circuit (IC) manufacturing at 0.35-micron to 0.13-micron technologies. Established in April 2000, SMIC, a Cayman Islands company, operates three 8-inch wafer fabrication facilities in the Zhangjiang High-Tech Park in Shanghai, and an 8-inch wafer fabrication facility in Tianjin, China. In addition, SMIC is currently constructing 12-inch wafer fabrication facilities in Beijing, China. SMIC's Fab 1 was named one of two "Top Fabs of the Year 2003" by Semiconductor International, a leading industry publication in May 2003. In addition to IC manufacturing, SMIC provides customers with a full range of services, including design services, mask manufacturing and wafer probe test. For more information, please visit

SMIC Contact:
Sarina Huang
Public Relations Department
Tel: 86 21 5080 2000 EXT10356
Fax: 86 21 5080 2868