Press Releases

SMIC forms foundry partnership with Elpida

06 Jan 2003

Shanghai  [2003-01-06]

(Shanghai, China, Jan. 6th, 2003) Semiconductor Manufacturing International Corporation (SMIC) and Elpida Memory, Inc. announced today that they have made a five-year arrangement on December 27, 2002. Under this arrangement, Elpida will choose SMIC as foundry partner to produce its 0.13-micron stacked-capacitor DRAM, and SMIC will start to produce DRAM chips for Elpida from 2003.

The cooperation will strengthen the relationship between Japan’s semiconductor and China’s foundry industries. The partnership will not only help Japan’s semiconductor industry to maintain its competitive edge, particularly in the area of IC technology and design, but also accelerate the progress of China’s IC foundry industry. This creates a win-win situation for both companies.

SMIC has established cooperation partnerships with many Japanese major semiconductor companies including Toshiba, Fujitsu, and Elpida etc. SMIC intends to offer the best IC foundry services to its customers and become a world-class foundry in China.

About SMIC
SMIC is the first pure-play advanced IC foundry in China to achieve volume production for 8-inch wafers at 0.25-micron and finer line technologies. Established in April 2000, SMIC is a Cayman Islands company based in Shanghai. The foundry provides customers with a full range of services that include: design services, mask manufacturing, wafer fabrication as well as testing capabilities. For more information, please visit

About Elpida Memory, Inc.
Elpida Memory, Inc. is a technology leader in Dynamic Random Access Memory (DRAM) with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida offers a broad range of leading-edge DRAM products including RDRAM®, SDRAM, DDR SDRAM, Mobile RAM and Consumer SDRAM. Device densities currently range up to 512 Megabits each, and Module (DIMM) densities range up to 2 Gigabytes each. Elpida offers a variety of standard and high performance packaging techniques, including TSOP, BGA, FBGA, Tape Carrier Package (TCP), and Double Density Package (DDP). Elpida's research, design and development operations were merged from NEC and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer-manufacturing facility is scheduled to begin production by January 2003. For more information, please visit

Ms Sarina Huang,
Public Relations
Tel: +86 21 5080 2000 x 10356
Fax: +86 21 5080 2868

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