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Testing, Packaging & Bumping Services |
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 SMIC
provides turnkey backend services through AT2, its assembly
and testing joint venture with UTAC, offering complete solutions
for SMIC customers¡¯ needs, from ordering to assembly, testing,
shipping, and distribution. Established in December 2004, AT2
has the global direction and resources to service an international
customer base, allowing partners to enjoy a number of benefits,
including first-to-market advantages, cost benefits with lowered
logistics, less time spent on sourcing, and a time buffer against
the market.
SMIC also cooperates with
a strong network of reliable and qualified companies including
STATS ChipPAC, ASE, UTAC, SPIL, Amkor, among others. These companies
are qualified by SMIC on their systems and products and according
to customer requirements, and in combination with AT2 make up
the final link in SMIC¡¯s ¡°one-stop shop¡± manufacturing chain.
For more information about AT2, please visit http://www.cd-at2.com
Testing Service
SMIC¡¯s test facility provides
customers with quick turnaround and strict quality control for
wafer-level testing. Equipped with advanced testing and laser
repair machines, SMIC¡¯s test facility offers customers comprehensive
testing services in 150 mm, 200 mm, and 300 mm wafer sizes for
logic, mixed signal and memory devices, including SDRAM, DDR2,
NAND Flash, EEPROM, Power MOSFET, Voltage Regulators, Memory
Modules, and CP testing. AT2 is certified in ISO9001, ISO14001,
QC080000, OSHAS18001, and is in the process of receiving TS16949
certification.
Services offered include wafer probing, epoxy probe card building
and repair as well as testing for contact and contactless IC
card types.
Our wafer probing services include test program development
as well as failure analysis and reliability testing.
We can build, repair and maintain epoxy probe cards of up to
16 DUTs and low-leakage probe cards.
Packaging Service
Current packaging options include:
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Au-bump (gold bumping) |
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DIP (dual inline package) |
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SOP (small-outline package) |
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PLCC (plastic leaded chip carrier) |
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TSOP (thin small outline package) |
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QFP (quad flat package) |
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LQFP (low profile quad flat package) |
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BGA (ball grid array) |
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mBGA (mini-ball grid array) |
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¦ÌBGA (micro ball grid array) |
Please contact us for other packaging options.
Wafer Bumping Service
SMIC offers 200 mm wafer bumping
services. This bumping line is capable of gold, eutectic/leadfree
solder bump processing, and redistribution layer (RDL) processing.
The solder bumping processes are compatible with both Al and
Cu pads. This service can be used on products such as LCD driver
IC, SOC, and high performance ICs that require flip chip or
wafer level chip scale packaging.
For more information, please contact
us.
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