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Testing, Packaging & Bumping Services |
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Assembly & Test Service
 SMIC
provides backend services through AT2, its assembly and testing
joint venture with UTAC. AT2 offers complete solutions for SMIC
customers¡¯ needs, including ordering, assembly, testing, shipping,
and distribution. Established in December 2004, AT2 has the
global direction and resources to serve an international customer
base. AT2 customers enjoy a number of benefits, including first-to-market
advantages, cost benefits with lowered logistics, less time
spent on sourcing, and a time buffer against the market. AT2
is also currently the leading provider of copper wire assembly
in China with more than 70% of all assembled parts using copper
wires.
Wafer Bumping Service
SMIC offers 200mm, 300mm wafer
bumping & wafer level chip scale packaging (WLCSP) services
through its affiliate SilTech Semiconductor (SH) Co., Ltd. This
bumping line is capable of eutectic/lead-free solder bump processing,
redistribution layer (RDL), WLCSP processing, and Die Processing
Services (DPS). The solder bumping processes are compatible
with both Al and Cu pads. This service can be used on products
such as SOC, RF devices, and high performance ICs that require
flip chip or wafer level chip scale packaging. DPS, which transforms
either bumped or WLCSP products from wafer form into die form
(including processes such as test and die saw, tape&reel),
is also installed to offer customers the option of having backend
service.
Wafer Probing / Testing Service
SMIC's test facility provides customers with quick turnaround
and strict quality control for wafer-level testing. Equipped
with advanced testing and laser repair machines, SMIC's test
facility offers customers comprehensive testing services in
150 mm, 200 mm, and 300 mm wafer sizes.
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Services offered include wafer probing, epoxy probe card building and repair as well as testing for contact and contactless IC card types.
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Our wafer probing services include test program development as well as failure analysis and reliability testing. |
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We can build, repair and maintain epoxy probe cards of up to 16 DUTs and low-leakage probe cards. |
Turnkey Service
In addition to SMIC¡¯s affiliated
backend service companies, SMIC Turnkey Service provides a full
line of backend supply chain management to deliver a complete
suite of wafer sort, wafer bumping, packaging assembly, and
final test services. This network is comprised of leading service
providers that are qualified at SMIC according to customer requirements.
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