Foundry Solutions Overview
Technology
• Advanced Logic
• 28nm MPW & Offering
• 28nm IP & Service
• 40nm
• 65nm/55nm
• Mature Logic
• SPOCULL
• 90nm, 0.13/0.11µm, 0.18µm,   0.25µm, 0.35µm
• eNVM
• Mixed Signal & RF
• Analog & Power
• Display Driver IC (DDIC)
• CMOS Image Sensor (CIS)
• MEMS
• Non-Volatile Memory (NVM)
• IoT Solutions
Turnkey Services
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SMIC Now
Multi-Project Wafer Service
Lab Services
24hrs Technical Support
Turnkey Services
In addition to SMIC’s affiliated backend service companies, SMIC Turnkey Services provide a full line of backend supply chain management to deliver a complete suite of wafer sort, wafer bumping, packaging & assembly, and final test services. This network is composed of leading service providers that are qualified at SMIC according to customer requirements.


Wafer Probing/ Testing ServicesSMIC's test facility provides customers with quick turnaround and strict quality control for wafer-level testing. Equipped with advanced testing and laser repair machines, SMIC's test facility offers customers comprehensive testing services in 200mm and 300mm wafer sizes.
Services offered include wafer probing, epoxy probe card building and repair as well as testing for contact and contactless IC card types.
 
Our wafer probing services include test program development as well as failure analysis and reliability testing.
SMIC can build, repair and maintain epoxy probe cards of up to 16 DUTs as well as low-leakage probe cards
   

Wafer Bumping ServiceSMIC offers 200mm and 300mm wafer bumping & wafer-level chip scale packaging (WLCSP) services through its affiliate SilTech. This bumping line is capable of lead-free solder bump processing, redistribution layer (RDL), WLCSP processing, and Die Processing Services (DPS). The solder bumping processes are compatible with both Al and Cu pads. This service can be used on products such as SoC, RF devices, and high performance ICs that require flip chip or wafer-level chip scale packaging. DPS, which takes either bumped or WLCSP products from wafer form into die form (including processes such as testing, die saw, tape & reel), is also offered for customers who require backend services.




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